Developments in MEMS manufacturing, like numerous technological industry, is considerably driven by efficiency, price, and size. Implementing SOI wafer solutions in the MEMS fabrication procedure enables manufacturing of smaller devices, more affordable prices and greater device performance. Let's have a look at how SOI wafers are produced and how they are advancing MEMS manufacturing.
The basic draw to SOI (Silicon-on-Insulator) wafer innovation is that it includes an electrically insulating layer to safeguard the micro device. They are produced utilizing 3 layers of material. The very first layer is the device layer; thin layers of high-grade silicon where the transistors are created. The 2nd layer is the insulating layer referred to as the BOX (buried oxide) that is generally produced of silicon dioxide. This layer keeps the transistors separated from the 3rd layer, the handle layer. The handle layer is made from bulk silicone and gives structural assistance to the device. SOI wafers might be either thick film or thin film, depending upon the application.
1. SMALLER DEVICES
The 1st benefit SOI solutions have more than bulk silicon wafers is that they allow production of smaller devices. The wafer manufacturing procedure makes the transistors more effective, allowing the manufacturing of more compact chips and greater chip yield per wafer since the chips can really be positioned closer together.
As modern technology becomes more compact, MEMS firms aim to develop chips which hold more data in a much smaller space. In the MEMs world SOI wafer applications are quite cool, since not only do they enable for smaller designs, they enable for more versatile designs with higher capacity.
2. MORE AFFORDABLE PRICES
When the initial price of is more costly than bulk silicon wafers, the extra features available with SOI actually produce lower manufacturing prices for a much better, advanced product. SOI wafers with pre-etched cavities are available and they streamline the MEMS manufacturing procedure by reducing development time. SOI wafers also enable production of better chips without the have to buy and implement more costly manufacturing devices.
With an increasing variety of MEMS foundries using SOI technology and manufacturing procedures as a requirement, the costs of these wafers have reduced considerably and continue to decrease.
MUCH BETTER EFFICIENCY
The last selling point for SOI is that it provides a solution to produce exceptional items. The insulating BOX layer decreases electrical current leak, which in turn decreases unneeded power usage and provides the transistor much better performance. It also minimizes heat, allowing these MEMS devices to be utilized in higher-temperature environments without any ill impacts.
The insulating layer also obstructs signal sound that not only enables the transistors' changing speeds to increase, but also leads to a more accurate item.
As you can see, SOI wafers are advancing MEMS manufacturing in a great method. Lots of engineering firms and also Universities utilize SOI wafers for development, testing and research. Implementing SOI solutions in the manufacturing of silicon wafers allows smaller, much better performing devices with a more varied variety of usages at a much better price for both the producer and buyer. Thus, SOI wafers are affecting MEMS fabrication in an amazing and positive method, when opening possibilities in new applications.